10120126-M0J-30DLF
CONN HEADER XCEDE PCBManufacturer: Amphenol ICC (FCI)
Categories: Specialized
Quality Control: Learn More
Amphenol ICC (FCI) XCede® Connector Header, Part Number 10120126-M0J-30DLF, is a high-density, right-wall, through-hole mounted header featuring male pins and blades. Designed for demanding backplane applications, this header offers 16 signal pairs and 18 ground contacts. The gold or GXT™ contact finish, with a thickness of 30.0µin (0.76µm), ensures reliable signal integrity and durability. With a 4-column configuration and all positions loaded, this component is engineered for advanced computing, telecommunications infrastructure, and high-performance networking systems. The black housing provides robust mechanical and environmental protection.
Additional Information
Series: XCede®RoHS Status: Request inventory verificationManufacturer Lead Time: No lead time information availableProduct Status: ObsoletePackaging: BulkDatasheet:Download Free CAD Model:&mpn=10120126-M0J-30DLF&lbl=1&lbc=000000&q3=1)
Technical Details:
| Features | - |
| Packaging | Bulk |
| Connector Type | Header, Male Pins and Blades |
| Contact Finish | Gold or Gold, GXT™ |
| Color | Black |
| Mounting Type | Through Hole |
| Number of Positions | - |
| Pitch | - |
| Number of Rows | - |
| Number of Positions Loaded | All |
| Termination | Press-Fit |
| Connector Usage | Backplane |
| Connector Style | XCede®, Right Wall |
| Contact Finish Thickness | 30.0µin (0.76µm) |
| Contact Layout, Typical | 16 Signal Pairs, 18 Ground |
| Number of Columns | 4 |
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