10120126-L0J-20DLF
CONN HEADER XCEDE PCBManufacturer: Amphenol ICC (FCI)
Categories: Specialized
Quality Control: Learn More
The Amphenol ICC (FCI) XCede® 10120126-L0J-20DLF is a high-density, multi-gigabit interconnect solution designed for demanding applications. This header features male pins and blades in a through-hole mounting style with a black housing. Engineered for robust performance in backplane connectivity, it offers a left-wall connector style within the specialized XCede® series. The contact finish is Gold or Gold, GXT™, with a thickness of 30.0µin (0.76µm) for excellent conductivity and durability. A typical contact layout includes 16 signal pairs and 18 ground contacts, supporting high-speed data transmission. This component is suitable for applications in the telecommunications, networking, and data center industries. The termination method is press-fit.
Additional Information
Series: XCede®RoHS Status: Request inventory verificationManufacturer Lead Time: No lead time information availableProduct Status: ObsoletePackaging: BulkDatasheet:Download Free CAD Model:&mpn=10120126-L0J-20DLF&lbl=1&lbc=000000&q3=1)
Technical Details:
| Features | - |
| Packaging | Bulk |
| Connector Type | Header, Male Pins and Blades |
| Contact Finish | Gold or Gold, GXT™ |
| Color | Black |
| Mounting Type | Through Hole |
| Number of Positions | - |
| Pitch | - |
| Number of Rows | - |
| Number of Positions Loaded | All |
| Termination | Press-Fit |
| Connector Usage | Backplane |
| Connector Style | XCede®, Left Wall |
| Contact Finish Thickness | 30.0µin (0.76µm) |
| Contact Layout, Typical | 16 Signal Pairs, 18 Ground |
| Number of Columns | 4 |
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