10120126-00J-30DLF
CONN HEADER XCEDE PCBManufacturer: Amphenol ICC (FCI)
Categories: Specialized
Quality Control: Learn More
Amphenol ICC (FCI) XCede® connector header, part number 10120126-00J-30DLF, features a robust design for demanding backplane applications. This through-hole mounted header utilizes male pins and blades, presented in a black housing. The XCede® connector style is engineered for high-speed signal integrity, with a typical contact layout supporting 16 signal pairs and 18 ground contacts. The gold or GXT™ contact finish offers superior conductivity and durability, with a 30.0µin (0.76µm) thickness. This component is commonly deployed in telecommunications infrastructure and enterprise networking systems where reliable, high-density interconnectivity is paramount. The bulk packaging ensures efficient handling for high-volume integration.
Additional Information
Series: XCede®RoHS Status: Request inventory verificationManufacturer Lead Time: No lead time information availableProduct Status: ObsoletePackaging: BulkDatasheet:Download Free CAD Model:&mpn=10120126-00J-30DLF&lbl=1&lbc=000000&q3=1)
Technical Details:
| Features | - |
| Packaging | Bulk |
| Connector Type | Header, Male Pins and Blades |
| Contact Finish | Gold or Gold, GXT™ |
| Color | Black |
| Mounting Type | Through Hole |
| Number of Positions | - |
| Pitch | - |
| Number of Rows | - |
| Number of Positions Loaded | All |
| Termination | Press-Fit |
| Connector Usage | Backplane |
| Connector Style | XCede® |
| Contact Finish Thickness | 30.0µin (0.76µm) |
| Contact Layout, Typical | 16 Signal Pairs, 18 Ground |
| Number of Columns | 4 |
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