10120124-M0E-30DLF
CONN HEADER XCEDE PCBManufacturer: Amphenol ICC (FCI)
Categories: Specialized
Quality Control: Learn More
Amphenol ICC (FCI) XCede® 10120124-M0E-30DLF is a high-density, right-angle header designed for backplane applications. This component features male pins and blades with a 30.0µin (0.76µm) gold or GXT™ contact finish, ensuring robust signal integrity. The header is constructed with a black, through-hole mounting type and an 8-column configuration, accommodating a substantial number of loaded positions. It is engineered with a typical contact layout of 24 signal pairs and 28 ground contacts, supporting demanding data communication and networking infrastructure. The termination method is press-fit, facilitating reliable assembly in high-performance systems. This connector is utilized in advanced telecommunications, data center equipment, and high-speed computing environments.
Additional Information
Series: XCede®RoHS Status: Request inventory verificationManufacturer Lead Time: No lead time information availableProduct Status: ObsoletePackaging: BulkDatasheet:Download Free CAD Model:&mpn=10120124-M0E-30DLF&lbl=1&lbc=000000&q3=1)
Technical Details:
| Features | - |
| Packaging | Bulk |
| Connector Type | Header, Male Pins and Blades |
| Contact Finish | Gold or Gold, GXT™ |
| Color | Black |
| Mounting Type | Through Hole |
| Number of Positions | - |
| Pitch | - |
| Number of Rows | - |
| Number of Positions Loaded | All |
| Termination | Press-Fit |
| Connector Usage | Backplane |
| Connector Style | XCede®, Right Wall |
| Contact Finish Thickness | 30.0µin (0.76µm) |
| Contact Layout, Typical | 24 Signal Pairs, 28 Ground |
| Number of Columns | 8 |
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