10120124-L0E-30DLF
CONN HEADER XCEDE PCBManufacturer: Amphenol ICC (FCI)
Categories: Specialized
Quality Control: Learn More
The Amphenol ICC (FCI) 10120124-L0E-30DLF is an XCede® series connector header designed for high-performance backplane applications. This male pin and blade header features a through-hole mounting type and a left wall connector style within the robust XCede® family. It offers 8 columns and a high density of contact positions loaded, typically supporting 24 signal pairs and 28 ground contacts, enabling significant data throughput. The header is constructed with a black housing. Contacts are finished with gold or GXT™, specified with a 30.0µin (0.76µm) thickness for superior conductivity and corrosion resistance. This component is commonly employed in demanding industries such as telecommunications, data networking, and high-performance computing where reliable, high-speed interconnectivity is paramount. Termination is achieved via a press-fit method.
Additional Information
Series: XCede®RoHS Status: Request inventory verificationManufacturer Lead Time: No lead time information availableProduct Status: ObsoletePackaging: BulkDatasheet:Download Free CAD Model:&mpn=10120124-L0E-30DLF&lbl=1&lbc=000000&q3=1)
Technical Details:
| Features | - |
| Packaging | Bulk |
| Connector Type | Header, Male Pins and Blades |
| Contact Finish | Gold or Gold, GXT™ |
| Color | Black |
| Mounting Type | Through Hole |
| Number of Positions | - |
| Pitch | - |
| Number of Rows | - |
| Number of Positions Loaded | All |
| Termination | Press-Fit |
| Connector Usage | Backplane |
| Connector Style | XCede®, Left Wall |
| Contact Finish Thickness | 30.0µin (0.76µm) |
| Contact Layout, Typical | 24 Signal Pairs, 28 Ground |
| Number of Columns | 8 |
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