10120124-00E-30DLF
CONN HEADER XCEDE PCBManufacturer: Amphenol ICC (FCI)
Categories: Specialized
Quality Control: Learn More
Amphenol ICC (FCI) XCede® series connector header, part number 10120124-00E-30DLF. This through-hole mounted male header features a black housing and is designed for backplane applications. It utilizes the XCede® connector style and is equipped with 24 signal pairs and 28 ground contacts. The contact finish is gold with a thickness of 30.0µin (0.76µm), offering excellent conductivity and corrosion resistance. The header is supplied in bulk packaging. This component is commonly deployed in high-density interconnects for telecommunications, data networking, and computing infrastructure.
Additional Information
Series: XCede®RoHS Status: Request inventory verificationManufacturer Lead Time: No lead time information availableProduct Status: ObsoletePackaging: BulkDatasheet:Download Free CAD Model:&mpn=10120124-00E-30DLF&lbl=1&lbc=000000&q3=1)
Technical Details:
| Features | - |
| Packaging | Bulk |
| Connector Type | Header, Male Pins and Blades |
| Contact Finish | Gold or Gold, GXT™ |
| Color | Black |
| Mounting Type | Through Hole |
| Number of Positions | - |
| Pitch | - |
| Number of Rows | - |
| Number of Positions Loaded | All |
| Termination | Press-Fit |
| Connector Usage | Backplane |
| Connector Style | XCede® |
| Contact Finish Thickness | 30.0µin (0.76µm) |
| Contact Layout, Typical | 24 Signal Pairs, 28 Ground |
| Number of Columns | 8 |
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