10120124-00E-20DLF
CONN HEADER XCEDE PCBManufacturer: Amphenol ICC (FCI)
Categories: Specialized
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Amphenol ICC (FCI) XCede® 10120124-00E-20DLF is a robust connector header designed for demanding backplane applications. This through-hole mounted component features male pins and blades with a black housing. The XCede® series is engineered for high-density interconnectivity, supporting up to 24 signal pairs and 28 ground contacts within its 8-column configuration. The contact finish utilizes gold, including GXT™ plating with a thickness of 30.0µin (0.76µm), ensuring reliable performance and durability. This connector is commonly employed in challenging environments such as telecommunications infrastructure, high-performance computing, and data center equipment. The termination method is press-fit, facilitating secure and efficient assembly onto printed circuit boards.
Additional Information
Series: XCede®RoHS Status: Request inventory verificationManufacturer Lead Time: No lead time information availableProduct Status: ObsoletePackaging: BulkDatasheet:Download Free CAD Model:&mpn=10120124-00E-20DLF&lbl=1&lbc=000000&q3=1)
Technical Details:
| Features | - |
| Packaging | Bulk |
| Connector Type | Header, Male Pins and Blades |
| Contact Finish | Gold or Gold, GXT™ |
| Color | Black |
| Mounting Type | Through Hole |
| Number of Positions | - |
| Pitch | - |
| Number of Rows | - |
| Number of Positions Loaded | All |
| Termination | Press-Fit |
| Connector Usage | Backplane |
| Connector Style | XCede® |
| Contact Finish Thickness | 30.0µin (0.76µm) |
| Contact Layout, Typical | 24 Signal Pairs, 28 Ground |
| Number of Columns | 8 |
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