10119130-M0C-30DLF
CONN HEADER XCEDE PCBManufacturer: Amphenol ICC (FCI)
Categories: Specialized
Quality Control: Learn More
Amphenol ICC (FCI) XCede® 10119130-M0C-30DLF is a high-density mezzanine connector header designed for demanding backplane applications. This right-angle header features male pins and blades with a 30.0µin (0.76µm) gold or GXT™ contact finish, ensuring robust signal integrity. The through-hole mounting design facilitates reliable PCB attachment. With a configuration supporting 36 signal pairs and 39 ground contacts, this connector is engineered for high-performance computing, telecommunications infrastructure, and data storage systems where superior electrical characteristics and density are paramount. The black housing and bulk packaging are standard for this robust interconnect solution.
Additional Information
Series: XCede®RoHS Status: Request inventory verificationManufacturer Lead Time: No lead time information availableProduct Status: ObsoletePackaging: BulkDatasheet:Download Free CAD Model:&mpn=10119130-M0C-30DLF&lbl=1&lbc=000000&q3=1)
Technical Details:
| Features | - |
| Packaging | Bulk |
| Connector Type | Header, Male Pins and Blades |
| Contact Finish | Gold or Gold, GXT™ |
| Color | Black |
| Mounting Type | Through Hole |
| Number of Positions | - |
| Pitch | - |
| Number of Rows | - |
| Number of Positions Loaded | All |
| Termination | Press-Fit |
| Connector Usage | Backplane |
| Connector Style | XCede®, Right Wall |
| Contact Finish Thickness | 30.0µin (0.76µm) |
| Contact Layout, Typical | 36 Signal Pairs, 39 Ground |
| Number of Columns | 6 |
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