10119130-L0C-30DLF
CONN HEADER XCEDE PCBManufacturer: Amphenol ICC (FCI)
Categories: Specialized
Quality Control: Learn More
Amphenol ICC (FCI) XCede® 10119130-L0C-30DLF is a high-density, right-angle printed circuit board connector header. This component features male pins and blades in a through-hole mounting style with a black housing. Designed for demanding backplane applications within the telecommunications and computing industries, it offers a robust connection interface. The contact finish is gold or GXT™ with a thickness of 30.0µin (0.76µm) for enhanced conductivity and durability. The connector layout is typically configured with 36 signal pairs and 39 ground contacts, providing ample connectivity for high-performance systems. The termination method is press-fit, ensuring secure and reliable mounting onto the PCB. This header is supplied in bulk packaging.
Additional Information
Series: XCede®RoHS Status: Request inventory verificationManufacturer Lead Time: No lead time information availableProduct Status: ObsoletePackaging: BulkDatasheet:Download Free CAD Model:&mpn=10119130-L0C-30DLF&lbl=1&lbc=000000&q3=1)
Technical Details:
| Features | - |
| Packaging | Bulk |
| Connector Type | Header, Male Pins and Blades |
| Contact Finish | Gold or Gold, GXT™ |
| Color | Black |
| Mounting Type | Through Hole |
| Number of Positions | - |
| Pitch | - |
| Number of Rows | - |
| Number of Positions Loaded | All |
| Termination | Press-Fit |
| Connector Usage | Backplane |
| Connector Style | XCede®, Left Wall |
| Contact Finish Thickness | 30.0µin (0.76µm) |
| Contact Layout, Typical | 36 Signal Pairs, 39 Ground |
| Number of Columns | 6 |
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