10119128-M0C-30DLF
CONN HEADER XCEDE PCBManufacturer: Amphenol ICC (FCI)
Categories: Specialized
Quality Control: Learn More
Amphenol ICC (FCI) XCede® connector header, part number 10119128-M0C-30DLF, offers a robust solution for high-performance backplane applications. This right-wall, through-hole mounted header features male pins and blades within its black, XCede® housing. Designed for demanding environments, it supports 18 signal pairs and 21 ground contacts, with a contact finish of gold or gold, GXT™ with a 30.0µin (0.76µm) thickness for superior conductivity and durability. The 6-column configuration ensures high density and efficient board space utilization. This component is engineered for use in telecommunications infrastructure, data centers, and high-speed computing systems where reliable signal integrity is paramount. The termination method is press-fit, facilitating secure and efficient assembly onto printed circuit boards.
Additional Information
Series: XCede®RoHS Status: Request inventory verificationManufacturer Lead Time: No lead time information availableProduct Status: ObsoletePackaging: BulkDatasheet:Download Free CAD Model:&mpn=10119128-M0C-30DLF&lbl=1&lbc=000000&q3=1)
Technical Details:
| Features | - |
| Packaging | Bulk |
| Connector Type | Header, Male Pins and Blades |
| Contact Finish | Gold or Gold, GXT™ |
| Color | Black |
| Mounting Type | Through Hole |
| Number of Positions | - |
| Pitch | - |
| Number of Rows | - |
| Number of Positions Loaded | All |
| Termination | Press-Fit |
| Connector Usage | Backplane |
| Connector Style | XCede®, Right Wall |
| Contact Finish Thickness | 30.0µin (0.76µm) |
| Contact Layout, Typical | 18 Signal Pairs, 21 Ground |
| Number of Columns | 6 |
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