10115091-00E-30DLF
CONN HEADER XCEDE PCBManufacturer: Amphenol ICC (FCI)
Categories: Specialized
Quality Control: Learn More
Amphenol ICC (FCI) XCede® Connector Header, part number 10115091-00E-30DLF, is a high-density, robust solution for demanding backplane applications. This Through Hole mounted header features male pins and blades, presented in a black housing. Designed for high-speed data transmission, it typically supports 32 signal pairs and 36 ground contacts across 8 columns. The gold or GXT™ contact finish, with a thickness of 30.0µin (0.76µm), ensures excellent conductivity and durability. This component is integral to systems requiring high-performance interconnects, commonly found in telecommunications infrastructure, data networking equipment, and high-performance computing. The termination method is Press-Fit, providing a reliable mechanical and electrical connection. Supplied in tray packaging.
Additional Information
Series: XCede®RoHS Status: Request inventory verificationManufacturer Lead Time: No lead time information availableProduct Status: ObsoletePackaging: TrayDatasheet:Download Free CAD Model:&mpn=10115091-00E-30DLF&lbl=1&lbc=000000&q3=1)
Technical Details:
| Features | - |
| Packaging | Tray |
| Connector Type | Header, Male Pins and Blades |
| Contact Finish | Gold or Gold, GXT™ |
| Color | Black |
| Mounting Type | Through Hole |
| Number of Positions | - |
| Pitch | - |
| Number of Rows | - |
| Number of Positions Loaded | All |
| Termination | Press-Fit |
| Connector Usage | Backplane |
| Connector Style | XCede® |
| Contact Finish Thickness | 30.0µin (0.76µm) |
| Contact Layout, Typical | 32 Signal Pairs, 36 Ground |
| Number of Columns | 8 |
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