10104997-L0C-20DLF
CONN HEADER XCEDE PCBManufacturer: Amphenol ICC (FCI)
Categories: Specialized
Quality Control: Learn More
Amphenol ICC (FCI) XCede® Series connector header, part number 10104997-L0C-20DLF. This through-hole mounted header features male pins and blades designed for backplane applications. The connector style is XCede®, Left Wall, with a contact finish of Gold or Gold, GXT™ with a thickness of 30.0µin (0.76µm). It typically supports 36 signal pairs and 39 grounds across 6 columns. This high-density interconnect solution is utilized in demanding applications within the telecommunications and data processing industries. Supplied in tray packaging.
Additional Information
Series: XCede®RoHS Status: RoHS CompliantManufacturer Lead Time: No lead time information availableProduct Status: ObsoletePackaging: TrayDatasheet:Download Free CAD Model:&mpn=10104997-L0C-20DLF&lbl=1&lbc=000000&q3=1)
Technical Details:
| Features | - |
| Packaging | Tray |
| Connector Type | Header, Male Pins and Blades |
| Contact Finish | Gold or Gold, GXT™ |
| Color | - |
| Mounting Type | Through Hole |
| Number of Positions | - |
| Pitch | - |
| Number of Rows | - |
| Number of Positions Loaded | All |
| Termination | Press-Fit |
| Connector Usage | Backplane |
| Connector Style | XCede®, Left Wall |
| Contact Finish Thickness | 30.0µin (0.76µm) |
| Contact Layout, Typical | 36 Signal Pairs, 39 Ground |
| Number of Columns | 6 |
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