XCZU9EG-L1FFVB1156I
IC SOC CORTEX-A53 1156FCBGAManufacturer: AMD
Categories: System On Chip (SoC)
Quality Control: Learn More
The AMD Zynq® UltraScale+™ MPSoC EG XCZU9EG-L1FFVB1156I is a heterogeneous System-on-Chip (SoC) integrating a powerful processing system with programmable logic. It features a Quad ARM® Cortex®-A53 MPCore™ processor for high-performance application processing, alongside Dual ARM® Cortex™-R5 processors with CoreSight™ for real-time control. Graphics acceleration is provided by the ARM Mali™-400 MP2. The device boasts over 599,000 logic cells, enabling extensive customization. Connectivity options include CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, and USB OTG. Peripherals such as DMA and WDT are integrated. This component operates across an industrial temperature range of -40°C to 100°C (TJ). The 1156-FCBGA (35x35) package is suitable for demanding applications in aerospace, defense, broadcast, and industrial automation.
Additional Information
Series: Zynq® UltraScale+™ MPSoC EGRoHS Status: ROHS3 CompliantManufacturer Lead Time: 16 week(s)Product Status: ActivePackaging: BulkDatasheet:Download Free CAD Model:
Technical Details:
| Packaging | Bulk |
| Package / Case | 1156-BBGA, FCBGA |
| Speed | 500MHz, 600MHz, 1.2GHz |
| RAM Size | 256KB |
| Operating Temperature | -40°C ~ 100°C (TJ) |
| Core Processor | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP |
| Primary Attributes | Zynq®UltraScale+™ FPGA, 599K+ Logic Cells |
| Connectivity | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
| Peripherals | DMA, WDT |
| Supplier Device Package | 1156-FCBGA (35x35) |
| Architecture | MCU, FPGA |
| Flash Size | - |
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