XCZU9EG-3FFVC900E
IC SOC CORTEX-A53 900FCBGAManufacturer: AMD
Categories: System On Chip (SoC)
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The AMD Zynq® UltraScale+™ MPSoC EG XCZU9EG-3FFVC900E is a heterogeneous System on Chip (SoC) integrating Quad ARM® Cortex®-A53 MPCore™ processors with CoreSight™ and Dual ARM® Cortex™-R5 processors with CoreSight™. This device offers over 599,000 logic cells and operates at speeds up to 600MHz for the Cortex-A53 cores and 1.5GHz for the FPGA fabric. It features a 900-FCBGA package with a pitch of 31x31, and includes peripherals such as DMA and WDT. Connectivity options include CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, and USB OTG. The operating junction temperature range is 0°C to 100°C. This component is suitable for applications in industrial automation, aerospace and defense, and broadcast infrastructure.
Additional Information
Series: Zynq® UltraScale+™ MPSoC EGRoHS Status: ROHS3 CompliantManufacturer Lead Time: 16 week(s)Product Status: ActivePackaging: TrayDatasheet:Download Free CAD Model:
Technical Details:
| Packaging | Tray |
| Package / Case | 900-BBGA, FCBGA |
| Speed | 600MHz, 1.5GHz |
| RAM Size | 256KB |
| Operating Temperature | 0°C ~ 100°C (TJ) |
| Core Processor | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ |
| Primary Attributes | Zynq®UltraScale+™ FPGA, 599K+ Logic Cells |
| Connectivity | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
| Peripherals | DMA, WDT |
| Supplier Device Package | 900-FCBGA (31x31) |
| Architecture | MCU, FPGA |
| Flash Size | - |
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