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XCZU7EV-3FBVB900E

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XCZU7EV-3FBVB900E

IC SOC CORTEX-A53 900FCBGA

Manufacturer: AMD

Categories: System On Chip (SoC)

Quality Control: Learn More

The AMD Zynq® UltraScale+™ MPSoC EV XCZU7EV-3FBVB900E is a System On Chip (SoC) integrating a Quad ARM® Cortex®-A53 MPCore™ with CoreSight™ and Dual ARM® Cortex™-R5 with CoreSight™ processors. This device features a Zynq® UltraScale+™ FPGA fabric with over 504,000 logic cells, operating at 600MHz and 1.5GHz, housed in a 900-FCBGA (31x31) package. Connectivity options include CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, and USB OTG. On-chip peripherals include DMA and WDT, with 256KB of RAM. This component is suitable for applications in aerospace and defense, automotive, industrial automation, and video processing. It operates within a junction temperature range of 0°C to 100°C.

Additional Information

Series: Zynq® UltraScale+™ MPSoC EVRoHS Status: ROHS3 CompliantManufacturer Lead Time: 16 week(s)Product Status: ActivePackaging: TrayDatasheet:
Technical Details:
PackagingTray
Package / Case900-BBGA, FCBGA
Speed600MHz, 1.5GHz
RAM Size256KB
Operating Temperature0°C ~ 100°C (TJ)
Core ProcessorQuad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Primary AttributesZynq®UltraScale+™ FPGA, 504K+ Logic Cells
ConnectivityCANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
PeripheralsDMA, WDT
Supplier Device Package900-FCBGA (31x31)
ArchitectureMCU, FPGA
Flash Size-

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