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XCZU7EV-1FBVB900I

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XCZU7EV-1FBVB900I

IC SOC CORTEX-A53 900FCBGA

Manufacturer: AMD

Categories: System On Chip (SoC)

Quality Control: Learn More

The AMD Zynq® UltraScale+™ MPSoC EV XCZU7EV-1FBVB900I is a System On Chip (SoC) featuring a heterogeneous processing system. It integrates a Quad ARM® Cortex®-A53 MPCore™ with CoreSight™ for application processing, a Dual ARM® Cortex™-R5 with CoreSight™ for real-time control, and an ARM Mali™-400 MP2 graphics processing unit. This device incorporates Zynq® UltraScale+™ FPGA fabric offering over 504K logic cells. Operating frequencies include 500MHz, 600MHz, and 1.2GHz. Connectivity options include CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, and USB OTG. The device includes peripherals such as DMA and WDT. The XCZU7EV-1FBVB900I is packaged in a 900-FCBGA (31x31) and operates within an industrial temperature range of -40°C to 100°C (TJ). This component is suitable for applications in aerospace, defense, automotive, and industrial automation.

Additional Information

Series: Zynq® UltraScale+™ MPSoC EVRoHS Status: ROHS3 CompliantManufacturer Lead Time: 16 week(s)Product Status: ActivePackaging: TrayDatasheet:
Technical Details:
PackagingTray
Package / Case900-BBGA, FCBGA
Speed500MHz, 600MHz, 1.2GHz
RAM Size256KB
Operating Temperature-40°C ~ 100°C (TJ)
Core ProcessorQuad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP
Primary AttributesZynq®UltraScale+™ FPGA, 504K+ Logic Cells
ConnectivityCANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
PeripheralsDMA, WDT
Supplier Device Package900-FCBGA (31x31)
ArchitectureMCU, FPGA
Flash Size-

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