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XCZU7EG-L1FBVB900I

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XCZU7EG-L1FBVB900I

IC SOC CORTEX-A53 900FCBGA

Manufacturer: AMD

Categories: System On Chip (SoC)

Quality Control: Learn More

The AMD Zynq® UltraScale+™ MPSoC EG XCZU7EG-L1FBVB900I is a heterogeneous System on Chip (SoC) designed for high-performance applications. This device integrates a quad-core ARM® Cortex®-A53 MPCore™ processor with CoreSight™, a dual-core ARM® Cortex™-R5 processor with CoreSight™, and an ARM Mali™-400 MP2 graphics processing unit. It features a substantial Zynq® UltraScale+™ FPGA fabric with over 504,000 logic cells, capable of operating at speeds up to 1.2GHz. The XCZU7EG-L1FBVB900I offers extensive connectivity options including CANbus, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, and USB OTG. Peripherals such as DMA and WDT enhance its control capabilities. This component is suitable for demanding industries such as automotive, aerospace, defense, and industrial automation. The device operates within a temperature range of -40°C to 100°C (TJ) and is supplied in a 900-FCBGA (31x31) package.

Additional Information

Series: Zynq® UltraScale+™ MPSoC EGRoHS Status: ROHS3 CompliantManufacturer Lead Time: 16 week(s)Product Status: ActivePackaging: TrayDatasheet:
Technical Details:
PackagingTray
Package / Case900-BBGA, FCBGA
Speed500MHz, 600MHz, 1.2GHz
RAM Size256KB
Operating Temperature-40°C ~ 100°C (TJ)
Core ProcessorQuad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP
Primary AttributesZynq®UltraScale+™ FPGA, 504K+ Logic Cells
ConnectivityCANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
PeripheralsDMA, WDT
Supplier Device Package900-FCBGA (31x31)
ArchitectureMCU, FPGA
Flash Size-

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