XCZU7EG-3FFVF1517E
IC SOC CORTEX-A53 1517FCBGAManufacturer: AMD
Categories: System On Chip (SoC)
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AMD Zynq® UltraScale+™ MPSoC EG series XCZU7EG-3FFVF1517E is a System On Chip (SoC) featuring a heterogeneous processing system. It integrates a Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, a Dual ARM® Cortex™-R5 with CoreSight™, and an ARM Mali™-400 MP2 graphics processing unit. This device includes a Zynq®UltraScale+™ FPGA fabric with over 504,000 logic cells, operating at speeds up to 1.5GHz. The component offers extensive connectivity options including CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, and USB OTG, along with peripherals like DMA and WDT. Designed for demanding applications, it is suitable for industries such as aerospace and defense, automotive, industrial, and wired communications. The device is supplied in a 1517-FCBGA (40x40) package and operates within a junction temperature range of 0°C to 100°C.
Additional Information
Series: Zynq® UltraScale+™ MPSoC EGRoHS Status: ROHS3 CompliantManufacturer Lead Time: 16 week(s)Product Status: ActivePackaging: TrayDatasheet:Download Free CAD Model:
Technical Details:
| Packaging | Tray |
| Package / Case | 1517-BBGA, FCBGA |
| Speed | 600MHz, 667MHz, 1.5GHz |
| RAM Size | 256KB |
| Operating Temperature | 0°C ~ 100°C (TJ) |
| Core Processor | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP |
| Primary Attributes | Zynq®UltraScale+™ FPGA, 504K+ Logic Cells |
| Connectivity | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
| Peripherals | DMA, WDT |
| Supplier Device Package | 1517-FCBGA (40x40) |
| Architecture | MCU, FPGA |
| Flash Size | - |
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