XCZU7EG-3FFVC1156E
IC SOC CORTEX-A53 1156FCBGAManufacturer: AMD
Categories: System On Chip (SoC)
Quality Control: Learn More
The AMD Zynq® UltraScale+™ MPSoC EG XCZU7EG-3FFVC1156E is a System On Chip (SoC) integrating a quad ARM® Cortex®-A53 MPCore™ with CoreSight™, dual ARM® Cortex™-R5 with CoreSight™, and ARM Mali™-400 MP2. This device features Zynq® UltraScale+™ FPGA fabric with over 504K logic cells, operating at clock speeds up to 1.5GHz. Connectivity options include CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, and USB OTG. Peripherals such as DMA and WDT are also included, alongside 256KB of RAM. The 1156-FCBGA (35x35) package facilitates deployment in applications requiring high processing power and flexible hardware acceleration, such as aerospace and defense, industrial automation, and automotive systems. Operating temperature range is 0°C to 100°C (TJ).
Additional Information
Series: Zynq® UltraScale+™ MPSoC EGRoHS Status: ROHS3 CompliantManufacturer Lead Time: 16 week(s)Product Status: ActivePackaging: TrayDatasheet:Download Free CAD Model:
Technical Details:
| Packaging | Tray |
| Package / Case | 1156-BBGA, FCBGA |
| Speed | 600MHz, 667MHz, 1.5GHz |
| RAM Size | 256KB |
| Operating Temperature | 0°C ~ 100°C (TJ) |
| Core Processor | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP |
| Primary Attributes | Zynq®UltraScale+™ FPGA, 504K+ Logic Cells |
| Connectivity | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
| Peripherals | DMA, WDT |
| Supplier Device Package | 1156-FCBGA (35x35) |
| Architecture | MCU, FPGA |
| Flash Size | - |
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