XCZU7EG-1FBVB900I
IC SOC CORTEX-A53 900FCBGAManufacturer: AMD
Categories: System On Chip (SoC)
Quality Control: Learn More
AMD Zynq® UltraScale+™ MPSoC EG XCZU7EG-1FBVB900I is a heterogeneous System on Chip (SoC) integrating Quad ARM® Cortex®-A53 MPCore™ processors with CoreSight™, Dual ARM® Cortex™-R5 processors with CoreSight™, and an ARM Mali™-400 MP2 graphics processing unit. This device features a Zynq® UltraScale+™ FPGA fabric with over 504,000 logic cells, supporting clock speeds up to 1.2GHz. Connectivity options include CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, and USB OTG. Peripherals such as DMA and WDT are integrated. This component is suitable for demanding applications in aerospace, defense, industrial automation, and high-performance computing. It operates within a temperature range of -40°C to 100°C (TJ) and is supplied in a 900-FCBGA (31x31) package.
Additional Information
Series: Zynq® UltraScale+™ MPSoC EGRoHS Status: ROHS3 CompliantManufacturer Lead Time: 16 week(s)Product Status: ActivePackaging: TrayDatasheet:Download Free CAD Model:
Technical Details:
| Packaging | Tray |
| Package / Case | 900-BBGA, FCBGA |
| Speed | 500MHz, 600MHz, 1.2GHz |
| RAM Size | 256KB |
| Operating Temperature | -40°C ~ 100°C (TJ) |
| Core Processor | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP |
| Primary Attributes | Zynq®UltraScale+™ FPGA, 504K+ Logic Cells |
| Connectivity | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
| Peripherals | DMA, WDT |
| Supplier Device Package | 900-FCBGA (31x31) |
| Architecture | MCU, FPGA |
| Flash Size | - |
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