XCZU7CG-L1FBVB900I
IC SOC CORTEX-A53 900FCBGAManufacturer: AMD
Categories: System On Chip (SoC)
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AMD Zynq® UltraScale+™ MPSoC CG family, part number XCZU7CG-L1FBVB900I, is a System on Chip (SoC) featuring a heterogeneous processing system. This device integrates dual ARM® Cortex®-A53 MPCore™ processors alongside dual ARM® Cortex™-R5 processors, each with CoreSight™ debugging capabilities. The programmable logic fabric offers over 504,000 logic cells, capable of operating at speeds up to 500MHz for the Cortex-A53 cores and 1.2GHz for the FPGA fabric. Connectivity options include CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, and USB OTG. The SoC includes peripherals such as DMA and WDT, and a 256KB of on-chip RAM. This component is housed in a 900-FCBGA (31x31) package and operates within an industrial temperature range of -40°C to 100°C (TJ). The XCZU7CG-L1FBVB900I is suitable for applications in automotive, industrial automation, and telecommunications.
Additional Information
Series: Zynq® UltraScale+™ MPSoC CGRoHS Status: ROHS3 CompliantManufacturer Lead Time: 16 week(s)Product Status: ActivePackaging: TrayDatasheet:Download Free CAD Model:
Technical Details:
| Packaging | Tray |
| Package / Case | 900-BBGA, FCBGA |
| Speed | 500MHz, 1.2GHz |
| RAM Size | 256KB |
| Operating Temperature | -40°C ~ 100°C (TJ) |
| Core Processor | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ |
| Primary Attributes | Zynq®UltraScale+™ FPGA, 504K+ Logic Cells |
| Connectivity | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
| Peripherals | DMA, WDT |
| Supplier Device Package | 900-FCBGA (31x31) |
| Architecture | MCU, FPGA |
| Flash Size | - |
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