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XCZU7CG-1FBVB900E

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XCZU7CG-1FBVB900E

IC SOC CORTEX-A53 900FCBGA

Manufacturer: AMD

Categories: System On Chip (SoC)

Quality Control: Learn More

The AMD Zynq® UltraScale+™ MPSoC CG XCZU7CG-1FBVB900E is a high-performance System on Chip (SoC) integrating a heterogeneous processing system with Zynq® UltraScale+™ FPGA fabric. This device features Dual ARM® Cortex®-A53 MPCore™ processors and Dual ARM® Cortex™-R5 processors, both equipped with CoreSight™ for advanced debugging. The FPGA fabric offers over 504,000 logic cells, capable of operating at frequencies up to 500MHz, complemented by the application processors running at 1.2GHz. Connectivity options include CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, and USB OTG. On-chip peripherals include DMA and WDT, with 256KB of RAM. This component is designed for demanding applications in sectors such as industrial automation, automotive, aerospace and defense, and communications infrastructure. The XCZU7CG-1FBVB900E is supplied in a 900-FCBGA (31x31) package, operating within a temperature range of 0°C to 100°C (TJ).

Additional Information

Series: Zynq® UltraScale+™ MPSoC CGRoHS Status: ROHS3 CompliantManufacturer Lead Time: 16 week(s)Product Status: ActivePackaging: TrayDatasheet:
Technical Details:
PackagingTray
Package / Case900-BBGA, FCBGA
Speed500MHz, 1.2GHz
RAM Size256KB
Operating Temperature0°C ~ 100°C (TJ)
Core ProcessorDual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Primary AttributesZynq®UltraScale+™ FPGA, 504K+ Logic Cells
ConnectivityCANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
PeripheralsDMA, WDT
Supplier Device Package900-FCBGA (31x31)
ArchitectureMCU, FPGA
Flash Size-

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