XCZU6CG-L1FFVC900I
IC SOC CORTEX-A53 900FCBGAManufacturer: AMD
Categories: System On Chip (SoC)
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The AMD Zynq® UltraScale+™ MPSoC CG XCZU6CG-L1FFVC900I is a System On Chip (SoC) featuring a heterogeneous processing system. It integrates dual ARM® Cortex®-A53 MPCore™ processors with CoreSight™ and dual ARM® Cortex™-R5 processors with CoreSight™. This device offers a substantial 469K+ logic cells within its Zynq® UltraScale+™ FPGA fabric, capable of operating at speeds up to 1.2GHz for the processor system and 500MHz for the FPGA. Connectivity options include CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, and USB OTG. The SoC incorporates peripherals such as DMA and WDT, and contains 256KB of on-chip RAM. Packaged in a 900-FCBGA (31x31) form factor, it is rated for an industrial operating temperature range of -40°C to 100°C (TJ). Applications span aerospace and defense, automotive, and industrial automation.
Additional Information
Series: Zynq® UltraScale+™ MPSoC CGRoHS Status: ROHS3 CompliantManufacturer Lead Time: 16 week(s)Product Status: ActivePackaging: TrayDatasheet:Download Free CAD Model:
Technical Details:
| Packaging | Tray |
| Package / Case | 900-BBGA, FCBGA |
| Speed | 500MHz, 1.2GHz |
| RAM Size | 256KB |
| Operating Temperature | -40°C ~ 100°C (TJ) |
| Core Processor | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ |
| Primary Attributes | Zynq®UltraScale+™ FPGA, 469K+ Logic Cells |
| Connectivity | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
| Peripherals | DMA, WDT |
| Supplier Device Package | 900-FCBGA (31x31) |
| Architecture | MCU, FPGA |
| Flash Size | - |
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