XCZU6CG-1FFVC900E
IC SOC CORTEX-A53 900FCBGAManufacturer: AMD
Categories: System On Chip (SoC)
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The AMD Zynq® UltraScale+™ MPSoC CG XCZU6CG-1FFVC900E is a heterogeneous System on Chip (SoC) integrating a powerful processing system with programmable logic. It features a dual ARM® Cortex®-A53 MPCore™ processor alongside a dual ARM® Cortex™-R5 processor, both equipped with CoreSight™ for debugging. The device boasts over 469,000 logic cells within its Zynq® UltraScale+™ FPGA fabric, operating at speeds up to 1.2GHz for the processing system and 500MHz for the FPGA. Connectivity options include CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, and USB OTG, complemented by DMA and WDT peripherals. This component is suitable for demanding applications in industrial automation, automotive, aerospace, and communications. The XCZU6CG-1FFVC900E is supplied in a 900-FCBGA (31x31) package and operates within a junction temperature range of 0°C to 100°C.
Additional Information
Series: Zynq® UltraScale+™ MPSoC CGRoHS Status: ROHS3 CompliantManufacturer Lead Time: 16 week(s)Product Status: ActivePackaging: TrayDatasheet:Download Free CAD Model:
Technical Details:
| Packaging | Tray |
| Package / Case | 900-BBGA, FCBGA |
| Speed | 500MHz, 1.2GHz |
| RAM Size | 256KB |
| Operating Temperature | 0°C ~ 100°C (TJ) |
| Core Processor | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ |
| Primary Attributes | Zynq®UltraScale+™ FPGA, 469K+ Logic Cells |
| Connectivity | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
| Peripherals | DMA, WDT |
| Supplier Device Package | 900-FCBGA (31x31) |
| Architecture | MCU, FPGA |
| Flash Size | - |
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