XCZU5EG-3FBVB900E
IC SOC CORTEX-A53 900FCBGAManufacturer: AMD
Categories: System On Chip (SoC)
Quality Control: Learn More
AMD Zynq® UltraScale+™ MPSoC EG XCZU5EG-3FBVB900E is a System on Chip (SoC) featuring a Quad ARM® Cortex®-A53 MPCore™ with CoreSight™ and Dual ARM® Cortex™-R5 with CoreSight™ processors. This device integrates a Zynq® UltraScale+™ FPGA with over 256K logic cells, operating at a speed of 600MHz for the FPGA fabric and up to 1.5GHz for the processor cores. The 900-FCBGA (31x31) package houses a 256KB RAM and includes peripherals such as DMA and WDT. Connectivity options encompass CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, and USB OTG. This component is widely utilized in aerospace and defense, automotive, and industrial applications.
Additional Information
Series: Zynq® UltraScale+™ MPSoC EGRoHS Status: ROHS3 CompliantManufacturer Lead Time: 16 week(s)Product Status: ActivePackaging: TrayDatasheet:Download Free CAD Model:
Technical Details:
| Packaging | Tray |
| Package / Case | 900-BBGA, FCBGA |
| Speed | 600MHz, 1.5GHz |
| RAM Size | 256KB |
| Operating Temperature | 0°C ~ 100°C (TJ) |
| Core Processor | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ |
| Primary Attributes | Zynq®UltraScale+™ FPGA, 256K+ Logic Cells |
| Connectivity | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
| Peripherals | DMA, WDT |
| Supplier Device Package | 900-FCBGA (31x31) |
| Architecture | MCU, FPGA |
| Flash Size | - |
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