XCZU57DR-L1FFVE1156I
IC ZUP RFSOC A53 FPGA LP 1156BGAManufacturer: AMD
Categories: System On Chip (SoC)
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The AMD Zynq® UltraScale+™ RFSoC DR series XCZU57DR-L1FFVE1156I is a System on Chip (SoC) featuring a powerful heterogeneous processing system. This device integrates Quad ARM® Cortex®-A53 MPCore™ processors with CoreSight™ and Dual ARM® Cortex™-R5 processors with CoreSight™. The device operates at speeds of 500MHz and 1.2GHz, housed in an 1156-FCBGA (35x35) package. It offers extensive connectivity options including CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, and USB OTG, alongside peripherals such as DDR, DMA, PCIe, and WDT. The XCZU57DR-L1FFVE1156I is designed for high-performance applications across industries like aerospace and defense, test and measurement, and wireless communications. Its operating temperature range is -40°C to 100°C (TJ).
Additional Information
Series: Zynq® UltraScale+™ RFSoC DRRoHS Status: ROHS3 CompliantManufacturer Lead Time: 16 week(s)Product Status: ActivePackaging: TrayDatasheet:Download Free CAD Model:
Technical Details:
| Packaging | Tray |
| Package / Case | 1156-BBGA, FCBGA |
| Speed | 500MHz, 1.2GHz |
| RAM Size | - |
| Operating Temperature | -40°C ~ 100°C (TJ) |
| Core Processor | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ |
| Primary Attributes | Zynq® UltraScale+™ RFSoC |
| Connectivity | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
| Peripherals | DDR, DMA, PCIe, WDT |
| Supplier Device Package | 1156-FCBGA (35x35) |
| Architecture | MPU, FPGA |
| Flash Size | - |
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