XCZU57DR-1FSVE1156I
IC ZUP RFSOC A53 FPGA 1156BGAManufacturer: AMD
Categories: System On Chip (SoC)
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The AMD Zynq® UltraScale+™ RFSoC DR series XCZU57DR-1FSVE1156I is a System on Chip (SoC) device integrating a Quad ARM® Cortex®-A53 MPCore™ with CoreSight™ and Dual ARM® Cortex™-R5 with CoreSight™ processors. This device features a 500MHz ARM Cortex-A53 cluster and a 1.2GHz ARM Cortex-R5 cluster, combined with a programmable logic fabric. Its architecture supports MPU and FPGA functionalities, enabling complex signal processing and control applications. Connectivity options include CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, and USB OTG. Peripherals such as DDR, DMA, PCIe, and WDT are also integrated. The XCZU57DR-1FSVE1156I is supplied in an 1156-FCBGA (35x35) package and operates within an industrial temperature range of -40°C to 100°C (TJ). This component is suitable for applications in telecommunications, aerospace and defense, and advanced test and measurement.
Additional Information
Series: Zynq® UltraScale+™ RFSoC DRRoHS Status: ROHS3 CompliantManufacturer Lead Time: 20 week(s)Product Status: ActivePackaging: TrayDatasheet:Download Free CAD Model:
Technical Details:
| Packaging | Tray |
| Package / Case | 1156-BBGA, FCBGA |
| Speed | 500MHz, 1.2GHz |
| RAM Size | - |
| Operating Temperature | -40°C ~ 100°C (TJ) |
| Core Processor | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ |
| Primary Attributes | Zynq® UltraScale+™ RFSoC |
| Connectivity | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
| Peripherals | DDR, DMA, PCIe, WDT |
| Supplier Device Package | 1156-FCBGA (35x35) |
| Architecture | MPU, FPGA |
| Flash Size | - |
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