XCZU55DR-L2FSVE1156I
IC ZUP RFSOC A53 FPGA LP 1156BGAManufacturer: AMD
Categories: System On Chip (SoC)
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AMD Zynq® UltraScale+™ RFSoC DR series System On Chip (SoC) with part number XCZU55DR-L2FSVE1156I. This device integrates a Quad ARM® Cortex®-A53 MPCore™ processor with CoreSight™ and a Dual ARM® Cortex™-R5 processor with CoreSight™. It features a flexible FPGA fabric and operates at speeds up to 533MHz for the Cortex-A53 cores and 1.3GHz for the Cortex-R5 cores. The XCZU55DR-L2FSVE1156I is housed in a 1156-FCBGA (35x35) package and supports a wide array of connectivity options including CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, and USB OTG. Peripherals include DDR, DMA, PCIe, and WDT. This component is suitable for demanding applications in telecommunications, aerospace, defense, and test and measurement industries. The operating temperature range is -40°C to 100°C (TJ).
Additional Information
Series: Zynq® UltraScale+™ RFSoC DRRoHS Status: ROHS3 CompliantManufacturer Lead Time: 20 week(s)Product Status: ActivePackaging: TrayDatasheet:Download Free CAD Model:
Technical Details:
| Packaging | Tray |
| Package / Case | 1156-BBGA, FCBGA |
| Speed | 533MHz, 1.3GHz |
| RAM Size | - |
| Operating Temperature | -40°C ~ 100°C (TJ) |
| Core Processor | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ |
| Primary Attributes | Zynq® UltraScale+™ RFSoC |
| Connectivity | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
| Peripherals | DDR, DMA, PCIe, WDT |
| Supplier Device Package | 1156-FCBGA (35x35) |
| Architecture | MPU, FPGA |
| Flash Size | - |
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