XCZU4EV-3FBVB900E
IC SOC CORTEX-A53 900FCBGAManufacturer: AMD
Categories: System On Chip (SoC)
Quality Control: Learn More
The AMD Zynq® UltraScale+™ MPSoC EV XCZU4EV-3FBVB900E is a high-performance System on Chip (SoC) designed for complex embedded applications. This device integrates a Quad ARM® Cortex®-A53 MPCore™ processor with CoreSight™ and a Dual ARM® Cortex™-R5 processor with CoreSight™, enabling sophisticated processing and real-time control. It features a Zynq® UltraScale+™ FPGA with over 192,000 logic cells, operating at speeds up to 600MHz for the FPGA fabric and 1.5GHz for the processor cores. Connectivity options include CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, and USB OTG. The SoC includes DMA and WDT peripherals, with 256KB of RAM. This component is suitable for demanding industries such as aerospace and defense, automotive, and industrial automation. It is supplied in a 900-FCBGA (31x31) package.
Additional Information
Series: Zynq® UltraScale+™ MPSoC EVRoHS Status: ROHS3 CompliantManufacturer Lead Time: 16 week(s)Product Status: ActivePackaging: TrayDatasheet:Download Free CAD Model:
Technical Details:
| Packaging | Tray |
| Package / Case | 900-BBGA, FCBGA |
| Speed | 600MHz, 1.5GHz |
| RAM Size | 256KB |
| Operating Temperature | 0°C ~ 100°C (TJ) |
| Core Processor | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ |
| Primary Attributes | Zynq®UltraScale+™ FPGA, 192K+ Logic Cells |
| Connectivity | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
| Peripherals | DMA, WDT |
| Supplier Device Package | 900-FCBGA (31x31) |
| Architecture | MCU, FPGA |
| Flash Size | - |
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