XCZU4EG-2FBVB900E
IC SOC CORTEX-A53 900FCBGAManufacturer: AMD
Categories: System On Chip (SoC)
Quality Control: Learn More
AMD Zynq® UltraScale+™ MPSoC EG XCZU4EG-2FBVB900E is a System On Chip (SoC) featuring a heterogeneous processing system. This device integrates a Quad ARM® Cortex®-A53 MPCore™ with CoreSight™ for application processing, alongside Dual ARM® Cortex™-R5 with CoreSight™ for real-time control. A graphics acceleration component, the ARM Mali™-400 MP2, is also included. The FPGA fabric offers over 192K logic cells. Connectivity options include CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, and USB OTG. Peripherals such as DMA and WDT are also supported. The device operates within a temperature range of 0°C to 100°C (TJ) and is packaged in a 900-FCBGA (31x31) format supplied in trays. This SoC is utilized in industries such as aerospace and defense, automotive, and industrial automation.
Additional Information
Series: Zynq® UltraScale+™ MPSoC EGRoHS Status: ROHS3 CompliantManufacturer Lead Time: 16 week(s)Product Status: ActivePackaging: TrayDatasheet:Download Free CAD Model:
Technical Details:
| Packaging | Tray |
| Package / Case | 900-BBGA, FCBGA |
| Speed | 533MHz, 600MHz, 1.3GHz |
| RAM Size | 256KB |
| Operating Temperature | 0°C ~ 100°C (TJ) |
| Core Processor | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP |
| Primary Attributes | Zynq®UltraScale+™ FPGA, 192K+ Logic Cells |
| Connectivity | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
| Peripherals | DMA, WDT |
| Supplier Device Package | 900-FCBGA (31x31) |
| Architecture | MCU, FPGA |
| Flash Size | - |
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