XCZU4CG-2FBVB900I
IC SOC CORTEX-A53 900FCBGAManufacturer: AMD
Categories: System On Chip (SoC)
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The AMD Zynq® UltraScale+™ MPSoC CG XCZU4CG-2FBVB900I is a System On Chip (SOC) designed for high-performance applications. This device integrates dual ARM® Cortex®-A53 MPCore™ processors with CoreSight™ and dual ARM® Cortex™-R5 processors with CoreSight™ for robust processing capabilities. It features a Zynq® UltraScale+™ FPGA fabric with over 192K logic cells. The component operates at speeds up to 1.3GHz for the processor cores and 533MHz for the FPGA fabric. Connectivity options include CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, and USB OTG. Peripherals include DMA and WDT, with 256KB of RAM. This SOC is housed in a 900-FCBGA (31x31) package and is rated for an operating temperature range of -40°C to 100°C (TJ). Its versatile architecture makes it suitable for industries such as aerospace, defense, industrial automation, and automotive.
Additional Information
Series: Zynq® UltraScale+™ MPSoC CGRoHS Status: ROHS3 CompliantManufacturer Lead Time: 16 week(s)Product Status: ActivePackaging: TrayDatasheet:Download Free CAD Model:
Technical Details:
| Packaging | Tray |
| Package / Case | 900-BBGA, FCBGA |
| Speed | 533MHz, 1.3GHz |
| RAM Size | 256KB |
| Operating Temperature | -40°C ~ 100°C (TJ) |
| Core Processor | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ |
| Primary Attributes | Zynq®UltraScale+™ FPGA, 192K+ Logic Cells |
| Connectivity | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
| Peripherals | DMA, WDT |
| Supplier Device Package | 900-FCBGA (31x31) |
| Architecture | MCU, FPGA |
| Flash Size | - |
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