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XCZU47DR-L2FSVG1517I

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XCZU47DR-L2FSVG1517I

IC ZUP RFSOC A53 FPGA LP 1517BGA

Manufacturer: AMD

Categories: System On Chip (SoC)

Quality Control: Learn More

The AMD Zynq® UltraScale+™ RFSoC XCZU47DR-L2FSVG1517I is a System on Chip (SoC) device featuring a heterogeneous processing system. It integrates Quad ARM® Cortex®-A53 MPCore™ processors alongside Dual ARM® Cortex™-R5 processors, both equipped with CoreSight™. This device incorporates a Zynq® UltraScale+™ FPGA fabric boasting over 930,000 logic cells. The dual-core ARM Cortex-R5 offers real-time processing capabilities, while the quad-core ARM Cortex-A53 provides application processing. The XCZU47DR-L2FSVG1517I operates within a temperature range of -40°C to 100°C (TJ) and comes in a 1517-FCBGA (40x40) package. Connectivity options include CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, and USB OTG. On-chip peripherals include DMA and WDT, with 256KB of RAM. This component is suitable for demanding applications in sectors such as telecommunications, aerospace and defense, and test and measurement.

Additional Information

Series: Zynq® UltraScale+™ RFSoCRoHS Status: ROHS3 CompliantManufacturer Lead Time: 16 week(s)Product Status: ActivePackaging: TrayDatasheet:
Technical Details:
PackagingTray
Package / Case1517-BBGA, FCBGA
Speed533MHz, 1.333GHz
RAM Size256KB
Operating Temperature-40°C ~ 100°C (TJ)
Core ProcessorQuad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Primary AttributesZynq®UltraScale+™ FPGA, 930K+ Logic Cells
ConnectivityCANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
PeripheralsDMA, WDT
Supplier Device Package1517-FCBGA (40x40)
ArchitectureMCU, FPGA
Flash Size-

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