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XCZU47DR-L2FFVE1156I

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XCZU47DR-L2FFVE1156I

IC ZUP RFSOC A53 FPGA LP 1156BGA

Manufacturer: AMD

Categories: System On Chip (SoC)

Quality Control: Learn More

The AMD Zynq® UltraScale+™ RFSoC XCZU47DR-L2FFVE1156I is a System on Chip (SoC) featuring a powerful heterogeneous processing system. It integrates Quad ARM® Cortex®-A53 MPCore™ processors with CoreSight™ and Dual ARM® Cortex™-R5 processors with CoreSight™, alongside extensive FPGA fabric offering over 930,000 logic cells. This device operates at clock speeds of 533MHz for the Cortex-A53 cores and up to 1.333GHz for the FPGA fabric. Designed for demanding applications, the XCZU47DR-L2FFVE1156I supports a wide range of connectivity options including CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, and USB OTG. On-chip peripherals include DMA and WDT, with 256KB of RAM. The device is housed in an 1156-FCBGA (35x35) package and operates within an industrial temperature range of -40°C to 100°C (TJ). This component is suitable for use in industries such as telecommunications, aerospace and defense, and test and measurement.

Additional Information

Series: Zynq® UltraScale+™ RFSoCRoHS Status: ROHS3 CompliantManufacturer Lead Time: 16 week(s)Product Status: ActivePackaging: TrayDatasheet:
Technical Details:
PackagingTray
Package / Case1156-BBGA, FCBGA
Speed533MHz, 1.333GHz
RAM Size256KB
Operating Temperature-40°C ~ 100°C (TJ)
Core ProcessorQuad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Primary AttributesZynq®UltraScale+™ FPGA, 930K+ Logic Cells
ConnectivityCANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
PeripheralsDMA, WDT
Supplier Device Package1156-FCBGA (35x35)
ArchitectureMCU, FPGA
Flash Size-

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