XCZU3EG-L1UBVA530I
IC ZUP MPSOC A53 FPGA LP 530BGAManufacturer: AMD
Categories: System On Chip (SoC)
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The AMD Zynq® UltraScale+™ MPSoC EG XCZU3EG-L1UBVA530I is a heterogeneous processing system-on-chip featuring a Quad ARM® Cortex®-A53 MPCore™ processor with CoreSight™, Dual ARM® Cortex™-R5 processors with CoreSight™, and an ARM Mali™-400 MP2 graphics processing unit. This device integrates a Zynq® UltraScale+™ FPGA fabric with over 154K logic cells, supporting clock speeds of 500MHz, 600MHz, and 1.2GHz. It offers extensive connectivity options including CANbus, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, and USB OTG. The XCZU3EG-L1UBVA530I is housed in a 530-FCBGA (16x9.5) package and operates within an industrial temperature range of -40°C to 100°C (TJ). This component is commonly utilized in applications requiring advanced processing and hardware acceleration across various industries.
Additional Information
Series: Zynq® UltraScale+™ MPSoC EGRoHS Status: ROHS3 CompliantManufacturer Lead Time: 26 week(s)Product Status: ActivePackaging: TrayDatasheet:Download Free CAD Model:
Technical Details:
| Packaging | Tray |
| Package / Case | 530-WFBGA, FCBGA |
| Speed | 500MHz, 600MHz, 1.2GHz |
| RAM Size | 256KB |
| Operating Temperature | -40°C ~ 100°C (TJ) |
| Core Processor | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP |
| Primary Attributes | Zynq®UltraScale+™ FPGA, 154K+ Logic Cells |
| Connectivity | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
| Peripherals | DMA, WDT |
| Supplier Device Package | 530-FCBGA (16x9.5) |
| Architecture | MPU, FPGA |
| Flash Size | - |
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