XCZU3EG-L1SFVC784I
IC SOC CORTEX-A53 784FCBGAManufacturer: AMD
Categories: System On Chip (SoC)
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The AMD Zynq® UltraScale+™ MPSoC EG series, part number XCZU3EG-L1SFVC784I, is a powerful System On Chip (SoC) integrating a Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM® Cortex™-R5 with CoreSight™, and an ARM Mali™-400 MP2 graphics processing unit. This device features over 154,000 logic cells within its Zynq® UltraScale+™ FPGA fabric, operating at clock speeds of 500MHz, 600MHz, and 1.2GHz. The 784-FCBGA (23x23) package offers extensive connectivity options including CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, and USB OTG. Peripherals such as DMA and WDT are also included. This component is designed for demanding applications across various industries, including industrial automation, aerospace and defense, and automotive. The operating temperature range is -40°C to 100°C (TJ).
Additional Information
Series: Zynq® UltraScale+™ MPSoC EGRoHS Status: ROHS3 CompliantManufacturer Lead Time: 16 week(s)Product Status: ActivePackaging: TrayDatasheet:Download Free CAD Model:
Technical Details:
| Packaging | Tray |
| Package / Case | 784-BFBGA, FCBGA |
| Speed | 500MHz, 600MHz, 1.2GHz |
| RAM Size | 256KB |
| Operating Temperature | -40°C ~ 100°C (TJ) |
| Core Processor | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP |
| Primary Attributes | Zynq®UltraScale+™ FPGA, 154K+ Logic Cells |
| Connectivity | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
| Peripherals | DMA, WDT |
| Supplier Device Package | 784-FCBGA (23x23) |
| Architecture | MCU, FPGA |
| Flash Size | - |
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