XCZU3EG-L1SBVA484I
IC SOC CORTEX-A53 484FCBGAManufacturer: AMD
Categories: System On Chip (SoC)
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AMD Zynq® UltraScale+™ MPSoC EG XCZU3EG-L1SBVA484I is a heterogeneous System On Chip (SoC) featuring a Quad ARM® Cortex®-A53 MPCore™ with CoreSight™ and Dual ARM® Cortex™-R5 with CoreSight™ processors. This device integrates an ARM Mali™-400 MP2 graphics processing unit and offers over 154K logic cells for the Zynq® UltraScale+™ FPGA fabric. Operating at speeds up to 1.2GHz, it supports a wide range of connectivity options including CANbus, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, and USB OTG. The XCZU3EG-L1SBVA484I is packaged in a 484-FCBGA (19x19) and operates within an industrial temperature range of -40°C to 100°C (TJ). Peripherals include DMA and WDT, with 256KB of integrated RAM. This component is suitable for applications in the automotive, industrial, and aerospace industries.
Additional Information
Series: Zynq® UltraScale+™ MPSoC EGRoHS Status: ROHS3 CompliantManufacturer Lead Time: 16 week(s)Product Status: ActivePackaging: TrayDatasheet:Download Free CAD Model:
Technical Details:
| Packaging | Tray |
| Package / Case | 484-BFBGA, FCBGA |
| Speed | 500MHz, 600MHz, 1.2GHz |
| RAM Size | 256KB |
| Operating Temperature | -40°C ~ 100°C (TJ) |
| Core Processor | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP |
| Primary Attributes | Zynq®UltraScale+™ FPGA, 154K+ Logic Cells |
| Connectivity | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
| Peripherals | DMA, WDT |
| Supplier Device Package | 484-FCBGA (19x19) |
| Architecture | MCU, FPGA |
| Flash Size | - |
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