XCZU3EG-2UBVA530I
IC SOC CORTEX-A53 530BGAManufacturer: AMD
Categories: System On Chip (SoC)
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AMD Zynq®UltraScale+™ XCZU3EG-2UBVA530I is a heterogeneous System-on-Chip (SoC) device featuring a Quad ARM® Cortex®-A53 MPCore™ processor with CoreSight™ and Dual ARM® Cortex™-R5 with CoreSight™ processors. This component integrates a programmable logic fabric with over 154K logic cells, operating at speeds up to 533MHz for the A53 cores and 1.3GHz for the R5 cores. The device offers extensive connectivity options including CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, and USB OTG. Peripherals such as DMA and WDT are also included. The XCZU3EG-2UBVA530I is housed in a 530-FCBGA package, measuring 16x9.5, and is specified for operation within an industrial temperature range of -40°C to 100°C (TJ). This SoC is well-suited for applications in industrial automation, automotive, aerospace, and communications.
Additional Information
Series: -RoHS Status: ROHS3 CompliantManufacturer Lead Time: 26 week(s)Product Status: ActivePackaging: TrayDatasheet:Download Free CAD Model:
Technical Details:
| Packaging | Tray |
| Package / Case | 530-WFBGA, FCBGA |
| Speed | 533MHz, 1.3GHz |
| RAM Size | 256KB |
| Operating Temperature | -40°C ~ 100°C (TJ) |
| Core Processor | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ |
| Primary Attributes | Zynq®UltraScale+™ FPGA, 154K+ Logic Cells |
| Connectivity | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
| Peripherals | DMA, WDT |
| Supplier Device Package | 530-FCBGA (16x9.5) |
| Architecture | MPU, FPGA |
| Flash Size | - |
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