XCZU3EG-2UBVA530E
IC ZUP MPSOC A53 FPGA 530BGAManufacturer: AMD
Categories: System On Chip (SoC)
Quality Control: Learn More
The AMD Zynq® UltraScale+™ MPSoC EG XCZU3EG-2UBVA530E is a heterogeneous System-on-Chip (SoC) combining a powerful processing system with a flexible programmable logic fabric. This device features a Quad ARM® Cortex®-A53 MPCore™ processor with CoreSight™, a Dual ARM® Cortex™-R5 processor with CoreSight™, and an ARM Mali™-400 MP2 graphics processing unit, offering robust compute capabilities. The integrated FPGA fabric provides over 154,000 logic cells, configurable for custom acceleration and parallel processing tasks. Supporting a wide array of connectivity interfaces including CANbus, Ethernet, I2C, SPI, UART/USART, USB OTG, and MMC/SD/SDIO, this component is well-suited for demanding applications in industrial automation, automotive, and advanced networking. Operating frequencies reach up to 1.333GHz for the processing system. The device is supplied in a 530-FCBGA package.
Additional Information
Series: Zynq® UltraScale+™ MPSoC EGRoHS Status: ROHS3 CompliantManufacturer Lead Time: 26 week(s)Product Status: ActivePackaging: TrayDatasheet:Download Free CAD Model:
Technical Details:
| Packaging | Tray |
| Package / Case | 530-WFBGA, FCBGA |
| Speed | 533MHz, 600MHz, 1.333GHz |
| RAM Size | 256KB |
| Operating Temperature | 0°C ~ 100°C (TJ) |
| Core Processor | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP |
| Primary Attributes | Zynq®UltraScale+™ FPGA, 154K+ Logic Cells |
| Connectivity | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
| Peripherals | DMA, WDT |
| Supplier Device Package | 530-FCBGA (16x9.5) |
| Architecture | MPU, FPGA |
| Flash Size | - |
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