XCZU3EG-1SFVA625E
IC SOC CORTEX-A53 625FCBGAManufacturer: AMD
Categories: System On Chip (SoC)
Quality Control: Learn More
AMD Zynq® UltraScale+™ MPSoC EG XCZU3EG-1SFVA625E is a heterogeneous System On Chip (SoC) featuring a Quad ARM® Cortex®-A53 MPCore™ with CoreSight™ and Dual ARM® Cortex™-R5 with CoreSight™ processors, complemented by an ARM Mali™-400 MP2 graphics processor. This device integrates a Zynq® UltraScale+™ FPGA fabric with over 154,000 logic cells, operating at clock speeds up to 1.2GHz. Connectivity options include CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, and USB OTG. Integrated peripherals include DMA and WDT. The device is housed in a 625-FCBGA (21x21) package and operates within a junction temperature range of 0°C to 100°C. This SoC is suitable for applications in automotive, industrial, aerospace, and defense sectors.
Additional Information
Series: Zynq® UltraScale+™ MPSoC EGRoHS Status: ROHS3 CompliantManufacturer Lead Time: 16 week(s)Product Status: ActivePackaging: TrayDatasheet:Download Free CAD Model:
Technical Details:
| Packaging | Tray |
| Package / Case | 625-BFBGA, FCBGA |
| Speed | 500MHz, 600MHz, 1.2GHz |
| RAM Size | 256KB |
| Operating Temperature | 0°C ~ 100°C (TJ) |
| Core Processor | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP |
| Primary Attributes | Zynq®UltraScale+™ FPGA, 154K+ Logic Cells |
| Connectivity | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
| Peripherals | DMA, WDT |
| Supplier Device Package | 625-FCBGA (21x21) |
| Architecture | MCU, FPGA |
| Flash Size | - |
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