XCZU3CG-L2UBVA530E
IC ZUP MPSOC A53 FPGA LP 530BGAManufacturer: AMD
Categories: System On Chip (SoC)
Quality Control: Learn More
AMD Zynq® UltraScale+™ MPSoC CG XCZU3CG-L2UBVA530E is a Heterogeneous System-on-Chip (SoC) featuring a dual ARM® Cortex®-A53 MPCore™ processor with CoreSight™ and dual ARM® Cortex™-R5 processor with CoreSight™. This device integrates a Zynq® UltraScale+™ FPGA fabric offering over 154K logic cells. It operates at clock speeds up to 1.3GHz for the application processor and 533MHz for the real-time processors. Connectivity options include CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, and USB OTG. The device includes peripherals such as DMA and WDT, and 256KB of on-chip RAM. The XCZU3CG-L2UBVA530E is supplied in a 530-FCBGA package (16x9.5) and is suitable for applications in industrial automation, automotive, and telecommunications.
Additional Information
Series: Zynq® UltraScale+™ MPSoC CGRoHS Status: ROHS3 CompliantManufacturer Lead Time: 26 week(s)Product Status: ActivePackaging: TrayDatasheet:Download Free CAD Model:
Technical Details:
| Packaging | Tray |
| Package / Case | 530-WFBGA, FCBGA |
| Speed | 533MHz, 1.3GHz |
| RAM Size | 256KB |
| Operating Temperature | 0°C ~ 100°C (TJ) |
| Core Processor | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ |
| Primary Attributes | Zynq®UltraScale+™ FPGA, 154K+ Logic Cells |
| Connectivity | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
| Peripherals | DMA, WDT |
| Supplier Device Package | 530-FCBGA (16x9.5) |
| Architecture | MPU, FPGA |
| Flash Size | - |
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