XCZU3CG-L1SFVA625I
IC SOC CORTEX-A53 625FCBGAManufacturer: AMD
Categories: System On Chip (SoC)
Quality Control: Learn More
AMD Zynq® UltraScale+™ MPSoC CG XCZU3CG-L1SFVA625I is a System On Chip (SoC) featuring a heterogeneous processing system. This device integrates Dual ARM® Cortex®-A53 MPCore™ processors with CoreSight™ and Dual ARM® Cortex™-R5 processors with CoreSight™, operating at up to 1.2GHz. The programmable logic fabric offers over 154,000 logic cells. Connectivity options include CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, and USB OTG. On-chip peripherals include DMA and WDT, with 256KB of RAM. This component is suitable for applications in aerospace and defense, industrial automation, and automotive sectors. It is supplied in a 625-FCBGA (21x21) package for tray packaging and operates across an industrial temperature range of -40°C to 100°C.
Additional Information
Series: Zynq® UltraScale+™ MPSoC CGRoHS Status: ROHS3 CompliantManufacturer Lead Time: 16 week(s)Product Status: ActivePackaging: TrayDatasheet:Download Free CAD Model:
Technical Details:
| Packaging | Tray |
| Package / Case | 625-BFBGA, FCBGA |
| Speed | 500MHz, 1.2GHz |
| RAM Size | 256KB |
| Operating Temperature | -40°C ~ 100°C (TJ) |
| Core Processor | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ |
| Primary Attributes | Zynq®UltraScale+™ FPGA, 154K+ Logic Cells |
| Connectivity | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
| Peripherals | DMA, WDT |
| Supplier Device Package | 625-FCBGA (21x21) |
| Architecture | MCU, FPGA |
| Flash Size | - |
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