XCZU3CG-2UBVA530E
IC ZUP MPSOC A53 FPGA 530BGAManufacturer: AMD
Categories: System On Chip (SoC)
Quality Control: Learn More
AMD Zynq® UltraScale+™ MPSoC CG XCZU3CG-2UBVA530E System on Chip. This device features a heterogeneous processing system with Dual ARM® Cortex®-A53 MPCore™ and Dual ARM® Cortex™-R5 processors, both equipped with CoreSight™. The Zynq® UltraScale+™ FPGA fabric offers over 154K logic cells, operating at a system clock speed of 533MHz and a processor clock speed of 1.3GHz. Connectivity options include CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, and USB OTG. Integrated peripherals include DMA and WDT. This component is housed in a 530-FCBGA package with dimensions of 16x9.5. Applications span automotive, industrial automation, and aerospace and defense sectors.
Additional Information
Series: Zynq® UltraScale+™ MPSoC CGRoHS Status: ROHS3 CompliantManufacturer Lead Time: 26 week(s)Product Status: ActivePackaging: TrayDatasheet:Download Free CAD Model:
Technical Details:
| Packaging | Tray |
| Package / Case | 530-WFBGA, FCBGA |
| Speed | 533MHz, 1.3GHz |
| RAM Size | 256KB |
| Operating Temperature | 0°C ~ 100°C (TJ) |
| Core Processor | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ |
| Primary Attributes | Zynq®UltraScale+™ FPGA, 154K+ Logic Cells |
| Connectivity | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
| Peripherals | DMA, WDT |
| Supplier Device Package | 530-FCBGA (16x9.5) |
| Architecture | MPU, FPGA |
| Flash Size | - |
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