XCZU3CG-1UBVA530I
IC SOC CORTEX-A53 530BGAManufacturer: AMD
Categories: System On Chip (SoC)
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AMD Zynq® UltraScale+™ XCZU3CG-1UBVA530I is a System On Chip (SoC) featuring a heterogeneous multiprocessing architecture. This device integrates dual ARM® Cortex®-A53 MPCore™ processors with CoreSight™ and dual ARM® Cortex™-R5 processors with CoreSight™ for balanced performance and real-time control. The FPGA fabric offers over 154,000 logic cells, enabling extensive customization and acceleration of complex tasks. Operating at speeds up to 500MHz for the application processors and 1.2GHz for the real-time processors, this SoC is suitable for demanding applications. Connectivity options include CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, and USB OTG. Peripherals such as DMA and WDT are integrated to enhance system functionality. The XCZU3CG-1UBVA530I is packaged in a 530-FCBGA (16x9.5) and operates within an industrial temperature range of -40°C to 100°C (TJ). This component is widely utilized in industrial automation, automotive, and telecommunications sectors.
Additional Information
Series: -RoHS Status: ROHS3 CompliantManufacturer Lead Time: 26 week(s)Product Status: ActivePackaging: TrayDatasheet:Download Free CAD Model:
Technical Details:
| Packaging | Tray |
| Package / Case | 530-WFBGA, FCBGA |
| Speed | 500MHz, 1.2GHz |
| RAM Size | 256KB |
| Operating Temperature | -40°C ~ 100°C (TJ) |
| Core Processor | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ |
| Primary Attributes | Zynq®UltraScale+™ FPGA, 154K+ Logic Cells |
| Connectivity | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
| Peripherals | DMA, WDT |
| Supplier Device Package | 530-FCBGA (16x9.5) |
| Architecture | MPU, FPGA |
| Flash Size | - |
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