XCZU3CG-1SFVC784I
IC SOC CORTEX-A53 784FCBGAManufacturer: AMD
Categories: System On Chip (SoC)
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The AMD Zynq® UltraScale+™ MPSoC CG XCZU3CG-1SFVC784I is a System On Chip (SoC) integrating ARM® Cortex®-A53 MPCore™ and ARM® Cortex™-R5 processors with extensive FPGA fabric. This device features dual ARM® Cortex®-A53 cores operating at up to 1.2GHz and dual ARM® Cortex™-R5 cores, complemented by CoreSight™ debug and trace capabilities. The FPGA portion offers over 154,000 logic cells and operates at 500MHz. On-chip peripherals include DMA and WDT. Connectivity options are comprehensive, supporting CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, and USB OTG. The XCZU3CG-1SFVC784I is housed in a 784-FCBGA (23x23) package, suitable for operation in industrial temperature ranges from -40°C to 100°C (TJ). This component is widely deployed in industrial automation, automotive, aerospace and defense, and medical applications.
Additional Information
Series: Zynq® UltraScale+™ MPSoC CGRoHS Status: ROHS3 CompliantManufacturer Lead Time: 16 week(s)Product Status: ActivePackaging: BulkDatasheet:Download Free CAD Model:
Technical Details:
| Packaging | Bulk |
| Package / Case | 784-BFBGA, FCBGA |
| Speed | 500MHz, 1.2GHz |
| RAM Size | 256KB |
| Operating Temperature | -40°C ~ 100°C (TJ) |
| Core Processor | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ |
| Primary Attributes | Zynq®UltraScale+™ FPGA, 154K+ Logic Cells |
| Connectivity | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
| Peripherals | DMA, WDT |
| Supplier Device Package | 784-FCBGA (23x23) |
| Architecture | MCU, FPGA |
| Flash Size | - |
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