XCZU3CG-1SFVA625E
IC SOC CORTEX-A53 625FCBGAManufacturer: AMD
Categories: System On Chip (SoC)
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AMD Zynq® UltraScale+™ MPSoC CG XCZU3CG-1SFVA625E is a System On Chip (SoC) featuring a heterogeneous processing system. This device integrates dual ARM® Cortex®-A53 MPCore™ processors with CoreSight™ and dual ARM® Cortex™-R5 processors with CoreSight™. The Zynq® UltraScale+™ FPGA fabric offers over 154,000 logic cells. It operates at clock speeds up to 1.2GHz for the application processors and 500MHz for the real-time processors. Connectivity options include CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, and USB OTG. Peripherals such as DMA and WDT are also included. The component is housed in a 625-FCBGA (21x21) package and operates within an industrial temperature range of 0°C to 100°C (TJ). This SoC is suitable for applications in industrial automation, automotive, and aerospace and defense sectors.
Additional Information
Series: Zynq® UltraScale+™ MPSoC CGRoHS Status: ROHS3 CompliantManufacturer Lead Time: 16 week(s)Product Status: ActivePackaging: BulkDatasheet:Download Free CAD Model:
Technical Details:
| Packaging | Bulk |
| Package / Case | 625-BFBGA, FCBGA |
| Speed | 500MHz, 1.2GHz |
| RAM Size | 256KB |
| Operating Temperature | 0°C ~ 100°C (TJ) |
| Core Processor | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ |
| Primary Attributes | Zynq®UltraScale+™ FPGA, 154K+ Logic Cells |
| Connectivity | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
| Peripherals | DMA, WDT |
| Supplier Device Package | 625-FCBGA (21x21) |
| Architecture | MCU, FPGA |
| Flash Size | - |
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