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XCZU2EG-L2UBVA530E

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XCZU2EG-L2UBVA530E

IC ZUP MPSOC A53 FPGA LP 530BGA

Manufacturer: AMD

Categories: System On Chip (SoC)

Quality Control: Learn More

AMD Zynq® UltraScale+™ MPSoC EG XCZU2EG-L2UBVA530E is a heterogeneous System on Chip (SoC) featuring a quad ARM® Cortex®-A53 MPCore™ processor with CoreSight™, dual ARM® Cortex™-R5 processors with CoreSight™, and an ARM Mali™-400 MP2 graphics processing unit. This device integrates a Zynq® UltraScale+™ FPGA fabric offering over 103K logic cells, operating at speeds up to 1.333GHz. Connectivity options include CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, and USB OTG. Peripherals include DMA and WDT. The XCZU2EG-L2UBVA530E is housed in a 530-FCBGA package with a 16x9.5mm footprint and operates within a junction temperature range of 0°C to 100°C. This component is suitable for demanding applications in aerospace and defense, industrial automation, and automotive sectors.

Additional Information

Series: Zynq® UltraScale+™ MPSoC EGRoHS Status: ROHS3 CompliantManufacturer Lead Time: 26 week(s)Product Status: ActivePackaging: TrayDatasheet:
Technical Details:
PackagingTray
Package / Case530-WFBGA, FCBGA
Speed533MHz, 600MHz, 1.333GHz
RAM Size256KB
Operating Temperature0°C ~ 100°C (TJ)
Core ProcessorQuad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP
Primary AttributesZynq®UltraScale+™ FPGA, 103K+ Logic Cells
ConnectivityCANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
PeripheralsDMA, WDT
Supplier Device Package530-FCBGA (16x9.5)
ArchitectureMPU, FPGA
Flash Size-

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