XCZU2CG-L2SFVA625E
IC SOC CORTEX-A53 625FCBGAManufacturer: AMD
Categories: System On Chip (SoC)
Quality Control: Learn More
AMD Zynq® UltraScale+™ MPSoC CG XCZU2CG-L2SFVA625E, a System On Chip (SoC) device, integrates dual ARM® Cortex®-A53 MPCore™ processors with CoreSight™ and dual ARM® Cortex™-R5 processors with CoreSight™. This device features a Zynq® UltraScale+™ FPGA with over 103K logic cells, operating at speeds up to 1.3GHz for the Cortex-A53 cores and 533MHz for the Cortex-R5 cores. Connectivity options include CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, and USB OTG. On-chip peripherals include DMA and WDT, with 256KB of RAM. This component is housed in a 625-FCBGA package (21x21) and is suitable for applications in aerospace and defense, automotive, industrial automation, and communication systems. It operates within a temperature range of 0°C to 100°C (TJ).
Additional Information
Series: Zynq® UltraScale+™ MPSoC CGRoHS Status: ROHS3 CompliantManufacturer Lead Time: 16 week(s)Product Status: ActivePackaging: TrayDatasheet:Download Free CAD Model:
Technical Details:
| Packaging | Tray |
| Package / Case | 625-BFBGA, FCBGA |
| Speed | 533MHz, 1.3GHz |
| RAM Size | 256KB |
| Operating Temperature | 0°C ~ 100°C (TJ) |
| Core Processor | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ |
| Primary Attributes | Zynq®UltraScale+™ FPGA, 103K+ Logic Cells |
| Connectivity | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
| Peripherals | DMA, WDT |
| Supplier Device Package | 625-FCBGA (21x21) |
| Architecture | MCU, FPGA |
| Flash Size | - |
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