XCZU2CG-2UBVA530E
IC SOC CORTEX-A53 530BGAManufacturer: AMD
Categories: System On Chip (SoC)
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AMD Zynq®UltraScale+™ SoC XCZU2CG-2UBVA530E features a heterogeneous processing system with dual ARM® Cortex®-A53 MPCore™ processors and dual ARM® Cortex™-R5 processors, both with CoreSight™ support. This System On Chip (SOC) integrates over 103K logic cells on an FPGA fabric clocked at 533MHz, with the processing system operating up to 1.3GHz. Connectivity options include CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, and USB OTG. On-chip peripherals include DMA and WDT, with 256KB of RAM available. The device is housed in a 530-FCBGA (16x9.5) package and operates within a junction temperature range of 0°C to 100°C. This component is commonly utilized in industrial automation, automotive, and telecommunications applications.
Additional Information
Series: -RoHS Status: ROHS3 CompliantManufacturer Lead Time: 26 week(s)Product Status: ActivePackaging: TrayDatasheet:Download Free CAD Model:
Technical Details:
| Packaging | Tray |
| Package / Case | 530-WFBGA, FCBGA |
| Speed | 533MHz, 1.3GHz |
| RAM Size | 256KB |
| Operating Temperature | 0°C ~ 100°C (TJ) |
| Core Processor | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ |
| Primary Attributes | Zynq®UltraScale+™ FPGA, 103K+ Logic Cells |
| Connectivity | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
| Peripherals | DMA, WDT |
| Supplier Device Package | 530-FCBGA (16x9.5) |
| Architecture | MPU, FPGA |
| Flash Size | - |
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