Manufacturer: AMD
Categories: System On Chip (SoC)
Quality Control: Learn More
Packaging | Tray |
Package / Case | 530-WFBGA, FCBGA |
Speed | 500MHz, 1.2GHz |
RAM Size | 256KB |
Operating Temperature | -40°C ~ 100°C (TJ) |
Core Processor | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ |
Primary Attributes | Zynq®UltraScale+™ FPGA, 103K+ Logic Cells |
Connectivity | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
Peripherals | DMA, WDT |
Supplier Device Package | 530-FCBGA (16x9.5) |
Architecture | MPU, FPGA |
Flash Size | - |