XCZU19EG-3FFVD1760E
IC SOC CORTEX-A53 1760FCBGAManufacturer: AMD
Categories: System On Chip (SoC)
Quality Control: Learn More
AMD Zynq® UltraScale+™ MPSoC EG XCZU19EG-3FFVD1760E is a System On Chip (SOC) featuring a Quad ARM® Cortex®-A53 MPCore™ processor with CoreSight™, a Dual ARM® Cortex™-R5 processor with CoreSight™, and an ARM Mali™-400 MP2 graphics processing unit. This device integrates a Zynq®UltraScale+™ FPGA with over 1.14 million logic cells, operating at frequencies up to 1.5GHz. Connectivity options include CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, and USB OTG. Peripherals consist of DMA and WDT. The component is housed in a 1760-FCBGA package with dimensions of 42.5x42.5mm, suitable for applications in aerospace, defense, automotive, and industrial automation. The operating temperature range is 0°C to 100°C (TJ).
Additional Information
Series: Zynq® UltraScale+™ MPSoC EGRoHS Status: ROHS3 CompliantManufacturer Lead Time: 20 week(s)Product Status: ActivePackaging: TrayDatasheet:Download Free CAD Model:
Technical Details:
| Packaging | Tray |
| Package / Case | 1760-BBGA, FCBGA |
| Speed | 600MHz, 667MHz, 1.5GHz |
| RAM Size | 256KB |
| Operating Temperature | 0°C ~ 100°C (TJ) |
| Core Processor | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP |
| Primary Attributes | Zynq®UltraScale+™ FPGA, 1143K+ Logic Cells |
| Connectivity | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
| Peripherals | DMA, WDT |
| Supplier Device Package | 1760-FCBGA (42.5x42.5) |
| Architecture | MCU, FPGA |
| Flash Size | - |
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